Semiconductor device

ABSTRACT

A fourth semiconductor region of a first conduction type is provided in a partial region of a third semiconductor region of a second conduction type. This configuration enhances the blocking voltage at the time when the sheet carrier concentration of a fifth semiconductor region is enhanced.

BACKGROUND OF THE INVENTION

The present invention relates to semiconductor devices such as aninsulated-gate bipolar transistor (IGBT), and more particularly to itslow-loss implementation.

The insulated-gate bipolar transistor (IGBT) is a switching element inwhich a current flown between a collector electrode and an emitterelectrode is controlled using a voltage applied to a gate electrode.This IGBT is provided with features that it is capable of dealing with acomparatively wide range of power, and that its switching frequency isbroad enough. Accordingly, in recent years, the IGBT has been in wideuse, which ranges from home-use small-power appliances, such as airconditioners and microwave ovens, to large-power appliances such asinverters in railroads and steelmaking plants.

Among these IGBT's performances, one of performances whose improvementis requested most seriously is a reduction in its loss. In recent years,implementation of low-loss IGBTs have been considered and designed.

For example, FIG. 11 illustrates a planar-type highly-conductive IGBTdisclosed in JP-A-10-178174. In this IGBT, a p layer 100 is in contactwith a collector electrode C. Moreover, an n layer 111, whose carrierconcentration is lower than that of this p layer 100, is multi-layeredon the p layer 100. An n⁻ layer 110, which has a substantially uniformcarrier concentration lower than that of the n layer 111, ismulti-layered on the n layer 111. An n layer 150 is diffused on theother surface side of this n⁻ layer 110. A p layer 120 is formed withinthe n layer 150, and further, an n⁺ layer 130 is formed within this player 120. On the surfaces of the n⁺ layer 130, the p layer 120, the nlayer 150, and the n⁻ layer 110, a MOS gate is provided which is formedby including an insulating film 300, an insulating film 400, and a gateelectrode G insulated with these insulating films 300 and 400.

Meanwhile, a p⁺ layer 121 is formed on the surface of the p layer 120.The p⁺ layer 121 and the n⁺ layer 130 are in low-resistance contact withan emitter electrode E. The respective electrodes E, C, and G areelectrically guided to terminals which correspond thereto respectively.

In this IGBT, its main feature is that the n layer 150 is formed on theperiphery and circumference of the p layer 120. By providing with this nlayer 150, it is made more difficult and less likely that holes flowinto the p layer 120 by the MOS gate, the holes being injected from thep layer 100 by electrons which have flown into the n⁻ layer 110, and itmakes the carrier concentration inside the n⁻ layer 110 higher. As aresult, the n⁻ layer 110 becomes highly conductive, which enablesimplementation of a low-loss IGBT. Here, the formation of the n layer150 increases the gate's feedback capacity which becomes a cause formalfunction due to noise. Accordingly, the feedback capacity is reducedby thickening the gate insulating film 300 partially.

Moreover, FIG. 12 illustrates a trench-type highly-conductive IGBTdisclosed in JP-A-2000-307116. In this IGBT, a plurality of trench-gatestructures T, which include a gate electrode G insulated with a gateinsulating film 300, are formed on the side of an emitter electrode Ealternately with two different spacings placed therebetween. Among thespacings between the trench gates, in the narrow-width portion, an nlayer 151 which is in contact with an n⁻ layer 110 is formed. A p layer120 is formed such that it is made adjacent to this n layer 151. Also, ap⁺ layer 121 and an n⁺ layer 130, which are in low-resistance contactwith the emitter electrode 600, are formed inside the p layer 120.

Meanwhile, among the spacings between the trench gates, in thebroad-width portion, a p layer 125 is formed. The p layer 125 isinsulated from the emitter electrode E with insulating films 401 and402. The n layer 151 becomes a barrier against holes which are injectedfrom the p layer 100. Accordingly, the n layer 151 exhibits an effect ofaccumulating electric charges within the n⁻ layer 110, thereby enhancingthe conductivity. Also, the p layer 125 has a function of collecting theholes injected from the p layer 100 into the p layer 125. These holesflow in proximity to the trench gate, then flowing into the emitterelectrode E via the n layer 151, the p layer 120, and the p⁺ layer 121.A potential difference when the holes flow in proximity to the trenchgate induces electron injection from an inversion layer of the trenchgate, and further, promotes conductivity modulation of the n⁻ layer 110.As a result of this, the IGBT becomes a low-loss IGBT.

SUMMARY OF THE INVENTION

In the above-described conventional IGBTs, the carrier concentration ofthe n layer 150 or 151, which intervenes between the p layer 120existing on the emitter side and the n⁻ layer 110 accumulating theelectric charges, is made higher. This enhancement operation reduces theON voltage, thereby enabling the conventional IGBTs to operate atlow-loss. There has been a problem, however, that making the carrierconcentration of this n layer 150 or 151 higher and higher results in alowering in the blocking voltage. As a specific experimental example, asillustrated in FIG. 13, raising the sheet carrier concentration (i.e.,plane density of the carrier concentration on a plane whose depth isconstant from the emitter-side surface) of the n layer 150 or 151reduces the ON voltage. The breakdown voltage, however, lowers steeplybeyond the sheet barrier concentration of 1×10¹²/cm² (this value can beregarded as the threshold value in this case), resulting in a loweringin the blocking-voltage.

Consequently, the ON voltage capable of maintaining the breakdownvoltage which is large enough from the practical viewpoint is restrictedby this limit (i.e., the value lower than 1×10¹²/cm²) of the sheetcarrier concentration of the n layer 150 or 151.

In view of the above-described actual circumstances, the presentinvention has been devised. Accordingly, one of the objects thereof isto provide a semiconductor device which makes it possible to accomplishthe low-loss operation without damaging the blocking voltage.

In the present invention for solving the problem in the above-describedconventional embodiments, there is provided a semiconductor device inwhich a collector electrode is provided such that the collectorelectrode is in contact with one surface side of a semiconductorsubstrate, the semiconductor device including; a first layer portion inwhich a first semiconductor region of a first conduction type, a secondsemiconductor region of a second conduction type, and a thirdsemiconductor region of the second conduction type having carrierconcentration lower than carrier concentration of the secondsemiconductor region are multilayered from the one surface side; asecond layer portion having a fourth semiconductor region of the firstconduction type multilayered in a partial region of the thirdsemiconductor region, and having carrier concentration higher thancarrier concentration of the third semiconductor region, a fifthsemiconductor region of the second conduction type multilayered on thefourth semiconductor region, a sixth semiconductor region of the firstconduction type multilayered on the fifth semiconductor region, and aseventh semiconductor region of the second conduction type multilayeredin a partial region of the sixth semiconductor region, and havingcarrier concentration higher than carrier concentration of the sixthsemiconductor region; a gate electrode located along the second layerportion via a gate insulating film, the gate insulating film beingprovided such that the gate insulating film is in contact with thesemiconductor regions included in the second layer portion; and anemitter electrode which is in low-resistance contact with the seventhsemiconductor region of the second layer portion.

Also, the plane density (i.e., sheet carrier concentration) of carrierconcentration on a plane whose distance from a surface on theemitter-electrode side is constant is set to be higher than 1×10¹²/cm²within the fourth semiconductor region.

Moreover, the surfaces of the sixth and seventh semiconductor regionswith which the emitter electrode is in contact, and the surfaces ontowhich the third, fourth, fifth, sixth and seventh semiconductor regionsare exposed and on which the gate oxide film is formed may exist onsubstantially the same flat plane. Furthermore, the gate oxide film maybe formed, along the respective semiconductor regions included in thesecond layer portion, and on a side surface of a trench, the trenchextending toward the first layer portion and attaining to the thirdsemiconductor region.

When the trench is provided in this way, the trench, on its one sidesurface, may be in contact with the respective semiconductor regionsincluded in the second layer portion, an eighth semiconductor region ofthe first conduction type being in contact with the other side surfaceof the trench, the eighth semiconductor region being multilayered withinthe third semiconductor region such that a partial region of the eighthsemiconductor region may be in contact therewith, and having carrierconcentration higher than the carrier concentration of the thirdsemiconductor region. Moreover, the trenches may be provided in pluralnumber. When the trenches are provided in plural number in this way, thetrenches may be arranged such that spacing between the trenches whichare adjacent to each other via the eighth semiconductor region is widerthan spacing between the trenches which are adjacent to each other withthe second layer portion sandwiched therebetween. Furthermore, a ninthsemiconductor region of the second conduction type may be formed withinthe sixth semiconductor region, the ninth semiconductor regionintervening between the seventh semiconductor region and the gate oxidefilm formed on the side surface of the trench.

Incidentally, the density of carrier concentration on a plane whosedistance from a surface on the emitter-electrode side is constant may belower than 1×10¹⁷/cm³ within the fifth semiconductor region.

Also, a semiconductor device according to one aspect of the presentinvention includes a semiconductor substrate portion of a secondconduction type; a first semiconductor layer multilayered on one surfaceside of the semiconductor substrate portion, and formed using asemiconductor of the second conduction type having a carrierconcentration higher than the carrier concentration of the semiconductorof the semiconductor substrate portion; a second semiconductor layermultilayered further on the first semiconductor layer, formed using asemiconductor of a first conduction type, and being in contact with acollector electrode; a semiconductor layer portion multilayered on theother surface side of the semiconductor substrate portion, thesemiconductor layer portion and a gate electrode being adjacent to eachother via an insulating film; the semiconductor layer portion having athird semiconductor layer being in contact with an emitter electrode,and formed using a semiconductor of the first conduction type, a fourthsemiconductor layer multilayered on a side of the third semiconductorlayer opposite to the emitter electrode, and formed using asemiconductor of the second conduction type having carrier concentrationlower than carrier concentration of the semiconductor of which the thirdsemiconductor layer is formed, and a fifth semiconductor layermultilayered further on the fourth semiconductor layer, and formed usinga semiconductor of the first conduction type; and an intervention layerportion intervening between the semiconductor substrate portion and thesemiconductor layer portion such that the intervention layer portion issandwiched therebetween, and formed using a semiconductor of the firstconduction type. In this case, the surface density of carrierconcentration on a surface whose distance from a surface on theemitter-electrode side is constant may be equal to or higher than1×10¹²/cm² in the intervention layer portion.

Also, this semiconductor device may be of either the planar-typestructure or the trench-type structure.

According to the present invention, it becomes possible to accomplishthe low-loss operation without damaging the blocking voltage.

Other objects, features and advantages of the invention will becomeapparent from the following description of the embodiments of theinvention taken in conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an explanatory diagram for illustrating a structure example ofthe semiconductor device according to an embodiment of the presentinvention.

FIG. 2 is an explanatory diagram for illustrating an example of thecarrier concentration of the semiconductor device according to theembodiment of the present invention.

FIG. 3 is an explanatory diagram for illustrating an experimental resultof the blocking voltage in the case that the sheet carrier concentrationof a fourth semiconductor region is modified in the semiconductor deviceaccording to the embodiment of the present invention.

FIG. 4 is an explanatory diagram for illustrating an experimental resultof the blocking voltage in the case that the sheet carrier concentrationof a fifth semiconductor region is modified in the semiconductor deviceaccording to the embodiment of the present invention.

FIG. 5 is an explanatory diagram for illustrating another structureexample of the semiconductor device according to the embodiment of thepresent invention.

FIG. 6 is an explanatory diagram for illustrating still anotherstructure example of the semiconductor device according to theembodiment of the present invention.

FIG. 7 is an explanatory diagram for illustrating a planar-typestructure example of the semiconductor device according to theembodiment of the present invention.

FIG. 8 is an explanatory diagram for illustrating a lateral-typestructure example of the semiconductor device according to theembodiment of the present invention.

FIG. 9 is an explanatory diagram for illustrating an example where thesemiconductor device according to the embodiment of the presentinvention has lateral-type planar structure.

FIG. 10 is an explanatory diagram for illustrating an example of a powerconverter which uses the semiconductor device according to theembodiment of the present invention.

FIG. 11 is the explanatory diagram for illustrating the structureexample of the planar structure semiconductor device.

FIG. 12 is the explanatory diagram for illustrating the example of thetrench-gate structure semiconductor device.

FIG. 13 is the explanatory diagram for illustrating the experimentalresult of the relationship among the sheet carrier concentration of then layer in contact with the n⁻ layer, the breakdown voltage, and the ONvoltage.

DETAILED DESCRIPTION OF THE INVENTION

Hereinafter, referring to the drawings, the explanation will be givenbelow concerning embodiments of the present invention. The semiconductordevice according to an embodiment of the present invention is an IGBTdevice, which is provided with a structure exemplified in FIG. 1.Namely, in this semiconductor device, from the side of a collectorelectrode C, a first layer portion 10 is formed by multilayering, fromthe side of a conductor plate 500 electrically connected to thecollector electrode C, a first semiconductor region 100 formed with asemiconductor of a first conduction type (p type in FIG. 1), a secondsemiconductor region 111 formed with a semiconductor of a secondconduction type (n type in FIG. 1), and a third semiconductor region 110of the second conduction type formed with a semiconductor having carrierconcentration lower than carrier concentration of the semiconductor withwhich the second semiconductor region 111 is formed.

Also, a gate insulating film (gate oxide film) 300 attains to the thirdsemiconductor region 110, thereby forming at least one trench T. FIG. 1illustrates a portion where the four trenches T are formed. The trenchesT are arranged with the spacings therebetween made differentalternately. Among these spacings, in a region where a comparativelybroad spacing is opened, a region (eighth semiconductor region) 125 ofthe first conduction type is sandwiched. Also, in a region where acomparatively narrow spacing is opened, a second layer portion 20 wherea plurality of semiconductor regions are multilayered is sandwiched.

This second layer portion 20 includes a fourth semiconductor region 122of the first conduction type which is in contact with a partial regionof the third semiconductor region 110, a fifth semiconductor region 151as a hole barrier layer which is multilayered on this fourthsemiconductor region 122, and formed with a semiconductor of the secondconduction type, and a sixth semiconductor region 120 multilayered onthis fifth semiconductor region 151, and formed with a semiconductor ofthe first conduction type. Also, a seventh semiconductor region 121,which is formed with a semiconductor of the first conduction type andwhich has carrier concentration higher than carrier concentration of thesixth semiconductor region 120, is formed in a partial region of thesixth semiconductor region 120. This seventh semiconductor region 121 isin no direct contact with the insulating films 300 and 402. Instead, asemiconductor region 130 formed with a semiconductor of the secondconduction type is made to intervene therebetween. The carrierconcentration of this semiconductor region 130 is made higher than thecarrier concentrations of the second and fifth semiconductor regions 111and 151.

Incidentally, the carrier concentration of the semiconductor with whichthe fourth semiconductor region 122 is formed is made higher than thecarrier concentration of the semiconductor with which the thirdsemiconductor region 110 is formed. Moreover, in the embodiment in FIG.1, the surface on which the fourth semiconductor region 122 is incontact with the third semiconductor region 110 is of substantially thesame depth as the surface on which the eighth semiconductor region 125is in contact with the third semiconductor region 110.

The gate insulating film 402 is provided such that the film 402 is incontact with the respective semiconductor regions 122, 151, and 120included in the second layer portion 20. Furthermore, a conductor 200electrically connected to a gate electrode G is located such that theconductor 200 is made adjacent to the second layer portion 20 via thegate insulating film 402. Also, an emitter electrode E is inlow-resistance contact (i.e., is electrically coupled) with the seventhsemiconductor region 121 of the second layer portion 20.

Also, here, the semiconductor with which the eighth semiconductor region125 of the first conduction type is formed is multilayered within thethird semiconductor region 110 such that a partial region of the eighthsemiconductor region is in contact therewith. Moreover, thesemiconductor has carrier concentration higher than the carrierconcentration of the semiconductor with which the third semiconductorregion 110 is formed.

In addition, in this embodiment, a semiconductor region of the secondconduction type is made to intervene between the seventh semiconductorregion 121 and the insulating films 300 and 402.

When the semiconductor device illustrated in FIG. 1 is cut away along across section A-B which passes through the central portion (portionincluding the seventh semiconductor region 121) of the second layerportion 20, a change in the carrier concentration along the crosssection A-B is illustrated in FIG. 2.

In this FIG. 2, the horizontal axis denotes depth heading from A to B,and the vertical axis denotes the sheet carrier concentration. The sheetcarrier concentration is calculated by integrating (totaling) thecarrier concentration along a plane perpendicular to the A-B crosssection (i.e., plane whose distance (depth) from the emitter-electrodeside is constant), and by dividing the integrated carrier concentrationby the plane's area. FIG. 3 illustrates an experimental result ofmeasurement of the blocking voltage when the sheet carrier concentrationin the fourth semiconductor region 122 is changed when the sheet carrierconcentration in the fifth semiconductor region 151 is made equal to orhigher than 1×10¹²/cm². As illustrated in FIG. 3, if the sheet carrierconcentration of the semiconductor with which the fourth semiconductorregion 122 is formed is made higher than 1×10¹²/cm², theblocking-voltage property is maintained even if the sheet carrierconcentration of the semiconductor with which the fifth semiconductorregion 151 is formed is set higher than 1×10¹²/cm².

Namely, the reason for this successful maintaining of theblocking-voltage property is as follows: Assuming that, e.g., the fifthsemiconductor region 151 is the n layer and the fourth semiconductorregion 122 is the p layer, in the case where the fourth semiconductorregion 122 is absent, as disclosed in JP-A-2003-347549, electric-fieldintensity in the p-n junction between the sixth semiconductor region 120and the fifth semiconductor region 151 is significantly high. As aresult, the breakdown occurs between the region 120 and the region 151of this p-n junction. In contrast to this situation, the presence of thefourth semiconductor region 122 makes it possible to suppress thesignificant enhancement in the electric-field intensity.

In this way, in present embodiment, the fourth semiconductor region 122(intervention layer) is caused to intervene between the fifthsemiconductor region 151 and the third semiconductor region 110.Moreover, the sheet carrier concentration of this intervention layer ismade higher than 1×10¹²/cm². This configuration and setting allows thesheet carrier concentration of the fifth semiconductor region 151 to bemade higher than 1×10¹²/cm² without lowering the breakdown voltage,thereby making it possible to reduce the ON voltage.

Incidentally, the fourth semiconductor region 122 and the fifthsemiconductor region 151 can be formed using an ion implantation methodwith applied acceleration voltage at a few MeV or more. This allowsimplementation of a desire shape and a carrier concentration, thusmaking it possible to achieve a high blocking voltage and a low ONvoltage.

Moreover, FIG. 4 illustrates an experimental result which was obtainedby changing the sheet carrier concentration of the fifth semiconductorregion 151 thereby analyzing the relationship with the blocking voltage.According to this result, when the sheet carrier concentration of thefifth semiconductor region 151 becomes higher than 1×10¹⁷/cm³, theblocking voltage lowers steeply. Consequently, making the sheet carrierconcentration of the fifth semiconductor region 151 lower than1×10¹⁷/cm³ allows the blocking voltage to be ensured more stably.

Furthermore, FIG. 5 illustrates another embodiment of the presentinvention. In this embodiment, a ninth semiconductor region 131 isformed between the eighth semiconductor region 125 and the gateinsulating film 402, using a semiconductor of the second conduction typedifferent from the conduction type of the semiconductor of the eighthsemiconductor region 125. The carrier concentration of this ninthsemiconductor region 131 is made higher than the carrier concentrationof the second semiconductor region 111 (e.g., the region 131 is formedas the n layer).

In this embodiment in FIG. 5, when the gate electrode G is switched ON,the n⁺ layer, which is the semiconductor region 130 surrounding theseventh semiconductor region 121, and the n⁺ layer, which is the ninthsemiconductor region 131, become conductive via the inversion layer andaccumulation layer on the periphery of the gate electrode G. Inaddition, a hole current, which flows through the p layer being theeighth semiconductor region 125, toward the emitter electrode 600,generates a potential difference within the eighth semiconductor region125. As a result, electrons are injected from the ninth semiconductorregion 131 into the eighth semiconductor region 125 and the thirdsemiconductor region 110 (the n⁻ layer in this embodiment).

This promotes the conductivity modulation in the third semiconductorregion 110 as well which is in proximity to the eighth semiconductorregion 125. Moreover, the ON voltage is reduced, which allowsaccomplishment of the low-loss operation. The situation remainsbasically the same if the conduction types are exchanged.

Incidentally, in the foregoing explanation, the trench gates arearranged with the broad spacing and the narrow spacing placedtherebetween alternately. The eighth semiconductor region 125 (and theninth semiconductor region 131), however, need not necessarily beprovided. In this case, as is exemplified in FIG. 6, the configurationis such that the trench gates and the second layer portions 20 arearranged alternately.

This configuration makes it possible to enhance cell density per unitarea, and to broaden channel width of the insulated gate. As a result,it becomes possible to reduce the ON voltage as well as to enhance itssaturation current density. This mode is effective in the low-lossoperation in such cases as sustain element where, like, e.g., plasmadisplay, the load equivalent circuit is regarded as a capacitor, so thata significant instantaneous current flows.

Also, in the embodiments so far, the explanation has been givenselecting the case of the trench-gate structure as its example. As isexemplified in FIG. 7, however, the planar-gate structure may also beemployed as the semiconductor device of the present embodiment.Moreover, when applying the semiconductor device of the presentembodiment to such integrated circuits as power IC, the lateral-typestructure may also be employed as is exemplified in FIG. 8. In thestructure exemplified in FIG. 8, the n⁻ layer 110, i.e., the thirdsemiconductor region, is provided on a support base 140 via theinsulating film 410. The electrode 500 electrically connected to thecollector electrode C is formed on substantially the same plane as theelectrode 600 electrically connected to the emitter electrode E. Thisconfiguration makes it possible to facilitate such operations as lineconnection with another semiconductor device on this same plane.Furthermore, in this lateral-type structure as well, the planar-gatestructure may also be employed as is exemplified in FIG. 9.

In all these embodiments, the sheet carrier concentration of the fourthsemiconductor region 122 is made equal to or higher than 1×10¹²/cm², andthe sheet carrier concentration of the fifth semiconductor region 151may be made equal to or lower than 1×10¹⁷/cm³.

FIG. 10 illustrates an example of a power converter where thesemiconductor device of the present embodiment is used. Incidentally,here, the semiconductor device of the present embodiment is denoted by anotation “IGBT”. Actually, the IGBT is provided with a four-layerstructure such as pnpn. The semiconductor device of the presentembodiment, however, differs therefrom in a point that the semiconductordevice is provided with a six-layer structure such as pnpnpn. Since anotation corresponding thereto is not defined in the presentcircumstances, the notation “IGBT” is substituted for the correspondingnotation. This power converter is a common inverter, and thus itsoperation is widely known. Accordingly, the detailed explanation thereofwill be omitted here. The embodiments where the semiconductor device isused for the inverter have been described here. Nevertheless, not onlyin the inverter but also in circuits such as converter where transistorsare used, the semiconductor device of the present embodiment isavailable by replacing the transistors by the IGBTs. Here referencenumerals 801 to 806 denote gate circuits.

It should be further understood by those skilled in the art thatalthough the foregoing description has been made on embodiments of theinvention, the invention is not limited thereto and various changes andmodifications may be made without departing from the spirit of theinvention and the scope of the appended claims.

1. A semiconductor device in which a collector electrode is providedsuch that said collector electrode is in contact with one surface sideof a semiconductor substrate, said semiconductor device, comprising: afirst layer portion in which a first semiconductor region of a firstconduction type, a second semiconductor region of a second conductiontype, and a third semiconductor region of said second conduction typehaving carrier concentration lower than a carrier concentration of saidsecond semiconductor region are multilayered from said one surface side;a second layer portion including a fourth semiconductor region of saidfirst conduction type multilayered in a partial region of said thirdsemiconductor region, and having a carrier concentration higher than thecarrier concentration of said third semiconductor region, a fifthsemiconductor region of said second conduction type multilayered on saidfourth semiconductor region, a sixth semiconductor region of said firstconduction type multilayered on said fifth semiconductor region, and aseventh semiconductor region of said second conduction type multilayeredin a partial region of said sixth semiconductor region, and having acarrier concentration higher than carrier concentration of said sixthsemiconductor region; a gate electrode located along said second layerportion via a gate insulating film, said gate insulating film beingprovided such that said gate insulating film is in contact with saidsemiconductor regions included in said second layer portion; and anemitter electrode which is in low-resistance contact with said seventhsemiconductor region of said second layer portion.
 2. The semiconductordevice according to claim 1, wherein a plane density of carrierconcentration on a plane whose distance from a surface on saidemitter-electrode side is constant is equal to or higher than 1×10¹²/cm²within said fourth semiconductor region.
 3. The semiconductor deviceaccording to claim 1, wherein surfaces of said sixth and seventhsemiconductor regions with which said emitter electrode is in contact,and surfaces of said third, fourth, fifth, sixth and seventhsemiconductor regions are exposed and on which said gate insulating filmis formed exist on substantially the same flat plane.
 4. Thesemiconductor device according to claim 1, wherein said gate oxide filmis formed along said respective semiconductor regions included in saidsecond layer portion, and on a side surface of a trench, said trenchextending toward said first layer portion and attaining to said thirdsemiconductor region.
 5. The semiconductor device according to claim 4,wherein said trench, on its one side surface, is in contact with saidrespective semiconductor regions included in said second layer portion,an eighth semiconductor region of said first conduction type being incontact with the other side surface of said trench, said eighthsemiconductor region being multilayered on said third semiconductorregion such that a partial region of said eighth semiconductor region isin contact said trench, and having a carrier concentration higher thanthe carrier concentration of said third semiconductor region.
 6. Thesemiconductor device according to claim 5, wherein said trenches areprovided in a plurality of number.
 7. The semiconductor device accordingto claim 6, wherein spacing between said trenches which are adjacent toeach other via said eighth semiconductor region is wider than spacingbetween said trenches which are adjacent to each other with said secondlayer portion sandwiched therebetween.
 8. The semiconductor deviceaccording to claim 5, wherein a ninth semiconductor region of saidsecond conduction type is formed within said sixth semiconductor region,said ninth semiconductor region intervening between said seventhsemiconductor region and said gate insulating film formed on said sidesurface of said trench.
 9. The semiconductor device according to claim1, wherein a density of carrier concentration on a plane whose distancefrom a surface on said emitter-electrode side is constant is equal to orlower than 1×10¹⁷/cm³ within said fifth semiconductor region.
 10. Asemiconductor device, comprising: a semiconductor substrate portion of asecond conduction type; a first semiconductor layer multilayered on onesurface side of said semiconductor substrate portion, and formed using asemiconductor of said second conduction type having a carrierconcentration higher than a carrier concentration of said semiconductorof said semiconductor substrate portion; a second semiconductor layermultilayered further on said first semiconductor layer, formed using asemiconductor of a first conduction type, and being in contact with acollector electrode; a semiconductor layer portion multilayered on theother surface side of said semiconductor substrate portion, saidsemiconductor layer portion and a gate electrode being adjacent to eachother via an insulating film, said semiconductor layer portion includinga third semiconductor layer being in contact with an emitter electrode,and formed using a semiconductor of said first conduction type, a fourthsemiconductor layer multilayered on a side of said third semiconductorlayer opposite to said emitter electrode, and formed using asemiconductor of said second conduction type having a carrierconcentration lower than a carrier concentration said thirdsemiconductor layer, and a fifth semiconductor layer multilayeredfurther on said fourth semiconductor layer, and formed using asemiconductor of said first conduction type; and an intervention layerportion intervening between said semiconductor substrate portion andsaid semiconductor layer portion such that said intervention layerportion is sandwiched therebetween, and formed using a semiconductor ofsaid first conduction type.
 11. The semiconductor device according toclaim 10, wherein plane density of carrier concentration on a planewhose distance from a surface on said emitter-electrode side is constantis equal to or higher than 1×10¹²/cm² in said intervention layerportion.
 12. The semiconductor device according to claims 10, whereinsaid semiconductor device is formed in a planar-type structure.
 13. Thesemiconductor device according to claims 10, wherein said gate electrodeis formed in a trench-type structure.